A Three-Tier SDN Based Distributed Mobility Management Architecture for DenseNets

Research output: A Conference proceeding or a Chapter in BookConference contribution

8 Citations (Scopus)
2 Downloads (Pure)

Abstract

Mobility management in cellular networks, such as the Long Term Evolution (LTE) System, relies on a centralized anchor, which depends on both the control plane and data plane. Therefore, mobility management suffers from many limitations such as low scalability and a single point of failure. Distributed Mobility Management (DMM) overcomes previous limitations and can be applied for HetNets or DenseNets. In this paper, we propose Three-Tiered Software Defined Networking (SDN)-based DMM to solve mobility problems and handover in DenseNets such as femtocells, in addition to macrocells. Our proposal reduces overhead signaling through the core network. As a result, it decreases delay and increases throughput over other cellular networks
Original languageEnglish
Title of host publicationIEEE International Conference on Communications (ICC), 2016
EditorsStefano Bregni, Nelson Fonseka
Place of PublicationNew York
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages1-6
Number of pages6
ISBN (Electronic)9781479966646
ISBN (Print)9781479966653
DOIs
Publication statusPublished - 2016
EventIEEE International Conference on Communications (ICC) 2016 - Kuala Lumpur, Kuala Lumpur, Malaysia
Duration: 22 Mar 201627 Mar 2016

Publication series

Name2016 IEEE International Conference on Communications, ICC 2016

Conference

ConferenceIEEE International Conference on Communications (ICC) 2016
Abbreviated titleICC 2016
CountryMalaysia
CityKuala Lumpur
Period22/03/1627/03/16

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  • Cite this

    Elgendi, I., MUNASINGHE, K., & Jamalipour, A. (2016). A Three-Tier SDN Based Distributed Mobility Management Architecture for DenseNets. In S. Bregni, & N. Fonseka (Eds.), IEEE International Conference on Communications (ICC), 2016 (pp. 1-6). [7511020] (2016 IEEE International Conference on Communications, ICC 2016). IEEE, Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ICC.2016.7511020